New Intel commissioned research finds robotics adoption accelerating—while gaps in strategy, skills, safety and infrastructure threaten organizations’ ability to scale.

August 20,2026 Summary

• Six in 10 senior business and IT leaders, robotics specialists, government and healthcare officials expect their organizations to operate robot fleets within five years.
• Leaders predict full-scale robotics deployment could double operational output.
• 67% believe they will be ready to manage a mixed human-robot workforce by 2030.
• 74% believe workforce planning and robotics strategy will become inseparable by 2030.
• Only 40% currently have a formal human-robot workforce strategy in place.

SANTA CLARA, Calif., [August 20, 2026] — Robotics is no longer a bet on the future — it’s a plan for the next five years. But according to new Intel research, The Robotics Readiness Gap, most organizations are moving faster than their operating models can support.

The study finds a stark disconnect: six in 10 senior leaders expect their organization to operate a fleet of robots within five years, but only four in 10 currently have a formal strategy to manage a mixed human-robot workforce. That gap between ambition and operational readiness is the central finding of the report.

Conducted in partnership with Man Bites Dog and Coleman Parkes Research, the research surveyed 800 senior business and IT leaders, robotics specialists, and government and healthcare officials across the United States, United Kingdom, Germany, Japan, China and South Korea. Respondents represented organizations with annual revenue exceeding $500 million.

The Robotics Readiness Gap confirms robotics has moved beyond experimentation. Organizations already deploying robots report measurable gains in productivity, quality and speed of service and increasingly view robotics not as a pilot project, but as a competitive necessity.

The next phase of robotics adoption won’t be defined by whether organizations can deploy robots — it will be defined by whether they’re ready to scale them. Those that embed robotics and Physical AI into their core operations, rather than layering them on top of existing systems, will be the ones who capture the full value of this shift.

John Healy

Vice President and General Manager, Industrial and Robotics Division, Intel

Five Factors of Robotics Readiness

Intel’s research identifies five factors that will separate organizations that scale robotics successfully from those that stall at the pilot stage:

• Strategy: Two-thirds (67%) of leaders are confident that their organization will be ready to manage a mixed human–robot workforce by 2030. Yet only 40% currently have a formal human-robot workforce strategy in place
• Skills: Two-thirds of leaders believe robotics will make their human workforce more skilled, not less. At the same time, four in 10 report that the availability of skills and talent is blocking their organization from scaling robotics.
• Safety: 31% of leaders cite safety as the area where robotics has delivered the greatest value. Meanwhile, 55% say safety concerns have delayed robotics deployment and 68% believe clearer global safety standards would help accelerate adoption.
• Shape: 77% of leaders say robotic performance matters more than appearance. Yet nearly two-thirds (65%) believe the ‘form factor’ of robots is currently dictated by technology limitations rather than real-world need.
• Scale: More than three-quarters of leaders say critical robotics applications require decisions within 100 milliseconds, with almost a quarter requiring responses in less than 10 milliseconds. Currently, 42% of organizations have a defined, funded edge or on-device AI strategy, while 39% are actively developing one.

Robotics and Physical AI Are Converging

Robotics and Physical AI are fast becoming the next frontier of enterprise transformation, bringing AI-powered perception, reasoning and decision-making into dynamic industry environments. As adoption moves from pilots to scaled deployment, Intel’s role: turning what works in the lab into infrastructure the whole market can build on. From edge AI silicon to the Intel Robotics AI Suite and OpenVINO Physical AI tools, Intel is building the foundation organizations need to close the readiness gap — not just participate in the robotics opportunity but scale it.

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Diamond Rapids, Crescent Island and Wildcat Lake demonstrate how Intel is scaling Agentic AI from the rack to the edge.

August 24,2026

What’s New: Intel is showcasing three architectures for Agentic AI and Enterprise-scale workloads, combining the Diamond Rapids processor for high-performance orchestration, the Crescent Island GPU for efficient inference and the Wildcat Lake SoC for intelligent client and edge computing.

Agentic AI is fundamentally changing how we design and deliver computing – from the transistor and package up through the full system architecture. The future is about tightly integrating general-purpose compute with purpose-built acceleration, advanced packaging and open chiplet technologies to build systems that can adapt to the workload and scale within real-world power, cost and deployment constraints.

Pushkar Ranade

The processors are underpinned by Intel Foundry technologies including the Intel 18A process family, Foveros Direct 3D packaging, and early adoption of the UCIe industry standard for open chiplet interconnects. Together, these capabilities provide a differentiated, scalable foundation for next-generation AI infrastructure.

What Intel is Presenting: At Hot Chips 2026, Intel will discuss three complementary architectures highlighting the next gen Xeon codenamed Diamond Rapids, the next gen datacenter GPU optimized for AI inference known as Crescent Island, and Wildcat Lake – launched as Intel Core Series 3 processors.

The compute foundation: Diamond Rapids is a versatile processor designed for enterprise-scale Agentic AI. Built exclusively on Intel technology, including the power- and performance-enhanced Intel 18A-P, Diamond Rapid’s introduces a new architecture. It combines adaptable compute building blocks, a unified memory fabric, and flexible I/O to deliver consistent high performance, efficiency and scalability. Intel is also highlighting its advanced SoC construction using Foveros Direct 3D and UCIe-S interconnect, along with a high-bandwidth memory subsystem, new Advanced Performance Extensions (APX), and enhanced Advanced Matrix Extensions (AMX) to accelerate next-generation AI applications.

• Up to 256 new cores with 1.28 GB LLC
• 16 memory channels with 12800 MT/s
• 128 lanes of PCIe Gen6 and CXL 3.0

Crescent Island reframes the economics of real-time AI inference: The architecture is designed to deliver more tokens and generate greater business value. Crescent Island is a low-power, easy-to-deploy GPU, with strong compute and high memory capacity, enabling larger models, longer context windows and more concurrent AI agents within existing air-cooled data center footprints. By improving inference economics at scale, it helps enterprises accelerate AI, increase infrastructure utilization, and achieve better returns on AI investments. Powered by Intel’s proven Xe architecture, Crescent Island’s design is optimized for next-generation Agentic AI workloads to deliver sustained inference performance, maximize token throughput and reduce cooling demands.

• 32 Xe cores and 256 XMX engines based on Xe3P
• Up to 480GB LPDDR5X memory
• 350-watt air-cooled PCIe card

Extending Agentic AI from the cloud to intelligent edge devices: Intel Core Series 3 processors, codenamed Wildcat Lake, bring right-sized AI capabilities to price-sensitive laptops and intelligent edge platforms. Built on the Intel 18A process, Wildcat Lake combines new CPU cores for high x86 single thread performance with integrated Xe3 graphics featuring XMX acceleration and an NPU delivering up to 17 TOPS for Hybrid AI. Wildcat Lake also marks the first use of UCIe in an Intel processor, enabling cost-effective multi-chip package designs for mainstream AI platforms.

• 2 performance cores and 4 efficiency cores
• Support for up to LPDDR5X-7467
• WiFi 7 and Bluetooth 6.0

Why It Matters: The future of agentic AI is inherently heterogeneous, spanning cloud, enterprise and edge environments where balancing performance and economics is critical.

Diamond Rapids provides a scalable compute foundation, Crescent Island addresses inference cost, and Wildcat Lake brings AI into mainstream client and edge systems. Anchored by Intel Foundry technologies and open industry standards, Intel is positioning its portfolio of offerings for deploying Agentic AI at scale.

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Intel partnering with Fuse Games. & Crystal Dynamics on STAR WARS: Galactic Racer™ and Tomb Raider: Legacy of Atlantis for Intel platforms, including XeSS 3 support at launch

August 10,2026

Intel’s annual Gamer Days campaign officially kicks off today, bringing gamers around the globe exciting new retail promotions, giveaways, and content collaborations with participating partners.

Headlining this year’s Intel® Gamer Days campaign is the Intel retail bundle running August 10^th through September 13^th. With this bundle, gamers can secure their own digital copies of Tomb Raider: Legacy of Atlantis and STAR WARS: Galactic Racer™ when they make a qualifying Intel® Core™, Intel® Core™ Ultra, or Intel® Arc™ Graphics purchase from one of Intel’s participating partners.

Additionally, Intel Gaming Access is running a Collector’s Edition giveaway for both Tomb Raider: Legacy of Atlantis and STAR WARS: Galactic Racer™ which will be running from August 10^th through September 10^th.

Launch Day Optimization on the Intel Platform

Intel’s excited to announce it will be the official launch partner for both Tomb Raider: Legacy of Atlantis (February 12, 2027) and STAR WARS: Galactic Racer™ (October 6, 2026). These partnerships are more than just a marketing exercise, as Intel works closely with both Fuse Games and Crystal Dynamics to ensure gamers are getting the best possible experience on their Intel-powered systems with the upcoming titles.

These partnerships include launch day enablement for the full suite of XeSS 3 technologies in both titles – including XeSS Super Resolution (SR), XeSS Multi-frame Generation (MFG), and Xe Low Latency (LL) – to ensure a smooth, high-fidelity gaming experience.

From the outset we wanted to create an experience that delights players, and making sure the game runs brilliantly on PC is an important part of that vision.We’ve worked closely with the team at Intel to help us fine-tune performance and deliver enhancements like XeSS 3, giving players the best possible experience when they jump in on October 6th.

Matt Webster

Founder & CEO, Fuse Games: We’re excited for players to discover Tomb Raider: Legacy of Atlantis on February 12, 2027. Intel has been an incredible partner throughout development, working closely with our team to ensure players enjoy an optimized and immersive experience when they step into our reimagining of Lara Croft’s debut adventure.

Availability

The Intel Gamer Days retail bundle featuring Tomb Raider: Legacy of Atlantis and STAR WARS: Galactic Racer™ includes purchases of the following qualifying Intel products from participating retail and OEM partners:

Desktop

• Intel Core Ultra 5 and 7 Plus processors (Series 2)
• Intel Core Ultra 5, 7, and 9 processors (Series 2)
• Intel Core 14^th Gen processors

Mobile

• Intel Core Ultra 5, 7, and 9 processors (Series 3)
• Intel Core Ultra 5 and 7 Plus processors (Series 2)
• Select mobile systems with Intel Core Ultra 5, 7, and 9 processors (Series 2)
• Intel Core processors (Series 2)
• Intel Arc G-series powered handheld devices

Intel Arc Graphics

• Intel Arc B-series discrete graphics cards
• Intel Arc A-series discrete graphics cards

With a qualifying purchase, gamers will get access to Tomb Raider: Legacy of Atlantis and STAR WARS: Galactic Racer™ download links on each title’s respective launch date. However, gamers will need to redeem their bundle offers by October 31^st, 2026, to receive the relevant download links.

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Collaboration leverages Gemini Enterprise and Google Cloud to expand Intel’s AI workforce capabilities via scalable agentic workflows across core business functions

SANTA CLARA, Calif., and SUNNYVALE, Calif. – July 16, 2026 – Intel and Google Cloud today announced an expansion of their previously announced multi-year strategic collaboration, which would accelerate Intel’s enterprise-wide digital evolution through the deployment of Gemini Enterprise and Google Cloud.

Intel will integrate advanced, Gemini-powered generative AI across its global workforce, helping to scale capabilities and bolster traditional workflows across engineering, supply chain, and corporate operations. Google Cloud’s highly scalable infrastructure will also augment Intel’s semiconductor development environment, introducing custom, agentic workflows to speed the chip design lifecycle and streamline cross-functional execution.

“As part of our AI-powered transformation, we are committed to offering our employees tools that help them move with greater speed, agility, and efficiency,” saidCindy Stoddard, senior vice president and chief information officer, Intel. “Our work with Google Cloud allows us to provide our employees with a central hub to build and deploy agents through Gemini Enterprise and scale silicon development with elastic cloud infrastructure. This collaboration gives Intel the AI tools and workflows needed to help reinvent its operations and execute business objectives more quickly.”

“Our work with Intel is about redefining the boundaries of what enterprise AI can achieve with Google Cloud,” said Karthik Narain, chief product and business officer, Google Cloud. “Pairing Intel’s engineering expertise with Google Cloud’s agentic AI tools creates an autonomous foundation that will fundamentally accelerate how they design, operate, and scale for the AI wave.”

Driving efficiency with Gemini Enterprise 

Intel’s integration of Google AI technologies moves the company beyond isolated enterprise AI pilot programs and introduces dedicated agentic coding assistance and engineering automation utilizing Gemini’s advanced reasoning capabilities to streamline development pipelines and automate complex, multi-step software workflows. By adopting Gemini Enterprise Agent Platform, Intel’s business functions can safely build and run tailored line-of-business (LOB) agents that automate core processes and accelerate data-backed execution.

As part of its AI transformation efforts, Intel is exploring Google Cloud-powered solutions that help teams streamline marketing and communications workflows, generate audience-specific content, and accelerate campaign execution. Early pilots include AI agents that can recommend the most relevant subject matter experts for a given topic, develop executive-ready messaging, and automatically create supporting materials across multiple communications channels.

Scaling silicon design on high-performance cloud infrastructure

Intel’s AI-enabled enterprise transformation is further supported by Google Cloud’s scalable infrastructure, which Intel is leveraging to optimize its silicon development simulations and core developer workloads. Google Cloud will augment Intel’s existing on-premises compute capabilities. By scaling on-premises compute cores to Google Cloud C4 and N4 instances, Intel’s engineering teams can run complex HPC simulations concurrently, accelerating chip development cycles.

This expansion builds on a long-standing history of co-innovation between the two companies, most recently highlighted by the collaboration to optimize next-generation AI infrastructure.

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Three generations across two years with one goal: bringing high-performance handheld gaming to life

At Computex in Taipei, Taiwan, the world got a glimpse into the first handheld gaming device powered by the all-new Intel® Arc™ G3 Extreme processor.

Created by Taiwan-based MSI, the Claw 8 EX AI+ is now available for sale in an eye-catching “void purple” color exclusive to the device.

But creating an all-new handheld design isn’t like building a laptop.

It took Intel and MSI over two years to conceptualize and design the Claw 8 EX AI+, which incorporates best practices from laptop designs and key learnings from previous generation handhelds. Together, Intel and MSI have crafted a device that’s a fraction of the size and weight of a regular mobile PC

Here are three things you need to know about how Intel’s top engineers helped MSI to create the Claw 8 EX AI+.

#1: A multi-generational engineering commitment that builds on past learnings

This isn’t the first time Intel and MSI have worked together on a handheld design: MSI’s previous generations handhelds were based on Intel® Core Ultra Series 1 (codenamed Meteor Lake) and Intel® Core Ultra 200V series (codenamed Lunar Lake) processors.

With the Intel® Arc G-Series processor family, Intel took a different approach by creating a purpose-built SoC optimized for handheld gaming.

“We distilled everything we learnt from the last two generations of handheld designs into a new category of devices that set a new standard for handheld experiences,” explained Nish Neelalojanan, said Intel’s senior director of Product Management, Client Computing and Physical AI Group.

Neelalojanan explained how past experience guided Intel’s engineers to remain laser-focused on creating a handheld device that provided the best gaming experience.

To achieve this, engineering teams made use of the unmatched efficiency of Intel Arc G3 Extreme to improve the handheld design and experience.

Elsewhere, software optimizations dramatically increased battery life and ensured the device remains cool to the touch under load for user comfort.

Additionally, Intel collaborated with key software leaders like Microsoft to ensure a seamless gaming experience via Xbox Mode on Windows 11.

The end result?

The MSI Claw 8 EX AI+ is the first Intel-based handheld to offer console-like accessibility, while also improving performance by freeing up system resources and precompiling shaders, leading to smoother gameplay.

#2: Striking a fine balance in a tightly enclosed space where “every millimeter counts”

With past handhelds, gamers typically faced a tough decision – prioritize the best gaming performance at the expense of shorter battery life or choose to extend gaming sessions at the expense of performance.

Those binary decisions are a relic of the past.

“I think one of the biggest reasons gamers should choose the new MSI Claw 8 EX AI+ is the incredible performance leap we’re seeing with the new Intel® Arc™ G3 Extreme platform,” said Joseph Shih, Claw product manager, MSI, explaining how top games like Cyberpunk 2077 now runs up to 37% faster, offer smoother frame rates and faster responsiveness.

Shih credits that huge leap in performance to the close collaboration between Intel and MSI.

“The key challenge in building any handheld is balancing performance, thermals, battery life, and comfort inside a very compact device – where every millimeter counts, as it will affect signal quality and compromise the end-user experience,” said Shih.

“From day one, both teams worked closely on motherboard layout, cooling, and power optimization to find the right balance between performance and efficiency.”

In one example of a close collaboration leading to a positive outcome, engineers decided to place the CPU and the DRAM components on opposite ends of the board to maximize space and optimize thermal efficiency, without affecting performance.

Other handheld designs tend to place these components next to each other to maintain signal strength.

“In a handheld, signal quality is extremely sensitive, so Intel’s signal simulation and validation support was critical to helping us achieve the right balance of stability, efficiency, and performance in such a compact body,” said Shih.

“What I really appreciated was how closely both teams worked behind the scenes. It genuinely felt like one engineering team focused on building the best possible handheld gaming experience for gamers,” Shih explained.

#3: The first successful power-on, pushes handheld gaming into AAA territory

Bruce Cheng fondly remembers January 2026 – it’s the month the joint Intel-MSI successfully powered on the MSI Claw 8 EX AI+ for the first time.

It was the moment that signaled two hard years of shared engineering work had finally paid off.

Cheng, director of Advanced Co-engineering in Intel’s Customer Client Engineering group says that moment validated that the tough board-level circuitry decisions and hours of discussions with his MSI counterparts were the right bets.

“This was the first sign that the long, hard road made across three generations of handheld design discussions were paying off. It was proof that the performance gains we aspired to achieve were not just theoretical,” said Cheng.

The hard work didn’t end there. In the months to come, Cheng and his team would double down on performance tuning the handheld to where it mattered most – running AAA-games – while also carrying out additional engineering validation to ensure the device met the highest specifications.

That wasn’t all.

The joint team also monitored the dynamics of game titles – especially as gaming trends and preferences shift faster than in the laptop business.

“This learning mindset of continuous feedback loops and openness by both teams to revisit assumptions, make tough decisions and to course correct quickly was critical to our ability to deliver on time,” Cheng explained.

The first of many more handheld designs

While the MSI Claw 8 Extreme AI+ is the world’s first handheld design based on the Intel Arc G3 Extreme chip, it won’t be the last.

At Computex Taiwan, Intel revealed more designs from its OEM partners like Acer and OneXPlayer are coming to market soon.

“The Arc G3 family for handheld devices proves we can bring PC-class performance and flexibility to handhelds, while offering smooth immersive gameplay and extended playtime. We’re proud of our collaboration with MSI as our pioneering partner for Intel-powered handhelds and look forward to seeing what the industry does next with Arc G3,” said Neelalojanan.

The Small Print:

Performance varies by use, configuration and other factors. Learn more at intel.com/performanceindex.  Performance results are based on testing as of dates shown in configurations and may not reflect all publicly available updates.  See backup for configuration details.  No product or component can be absolutely secure.

Your costs and results may vary.  Intel technologies may require enabled hardware, software or service activation.

Intel does not control or audit third-party data. You should consult other sources to evaluate accuracy.

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NEWS HIGHLIGHTS:

• The U.S. is at an inflection point. Artificial intelligence is reshaping global competition and increasing the need for secure, domestic semiconductor production.
• U.S. leadership in the AI era will be defined by innovation, domestic manufacturing, and workforce readiness. Strong semiconductor leadership is essential to economic growth, national security, and long-term global competitiveness.
• For nearly 60 years, Intel has helped power the digital age and continues to strengthen the U.S. innovation ecosystem through a nationwide R&D and manufacturing footprint.
• Intel’s end-to-end capabilities across design, manufacturing, and advanced packaging, along with its foundry model, position the company to provide the foundation for AI at scale.
• Looking ahead, Intel is focused on advancing the technology and talent that will define the next 250 years of U.S. leadership.

As artificial intelligence reshapes global competition, the next chapter of the American story will depend on how the nation leads in innovation, builds critical technologies at home, strengthens its workforce, and expands opportunity for future generations.

For nearly six decades, Intel has been an integral part of that story, advancing breakthroughs that have powered the digital age and helped transform industries around the world. Today, that work continues through a nationwide footprint spanning research, development, and manufacturing across Oregon, Arizona, New Mexico, California, and a planned site in Ohio, bolstering the nation’s innovation infrastructure needed for the AI era.

Growing AI demand across the global economy is increasing the importance of secure, domestic semiconductor production and the systems that power it. Intel’s approach—spanning silicon design, manufacturing, and advanced packaging—along with Intel Foundry’s integrated systems foundry model, is designed to deliver the performance and scale required for the AI era while advancing U.S. leadership in critical technologies. Intel Xeon processors, the most widely deployed host CPUs, also play a foundational role in AI, supporting key capabilities in memory, security, and orchestration.

Together, these end-to-end capabilities—spanning design, manufacturing, and advanced packaging—position Intel as an important foundation for the AI era and renewed U.S. technology leadership. This progress is reflected in 2026 recognition across independent benchmarks, including Fortune’s list of America’s Most Innovative Companies, a Platinum designation on the American Opportunity Index’s Where You Work Matters list, and inclusion on TIME’s inaugural list of America’s Most Iconic Companies, showcasing Intel’s sustained influence on U.S. industry and innovation.

As the nation marks this milestone year, Intel is partnering with America250, the national, nonpartisan organization established by Congress to lead the commemoration of the 250th anniversary of the signing of the Declaration of Independence. Through this collaboration, Intel supports initiatives that celebrate American innovation and technological achievement and highlight the builders shaping the future—reflecting a shared commitment to inspiring the next generation of innovators, entrepreneurs, scientists, and engineers.

This work is grounded in a simple idea: that strong domestic technology leadership is essential to economic growth, national security, and long-term global competitiveness. Intel is advancing that vision through continued investment in U.S.-based manufacturing and through initiatives like USAI, which aim to expand secure, responsible AI solutions for government and public sector applications.

Equally important is investing in people. The future of American innovation depends on a workforce equipped with the skills to succeed in a rapidly evolving technology landscape. Intel’s Semiconductor Education Pathways Program (SEPP) strengthens education pathways from K-12 through post-secondary education and supports professional upskilling. SEPP focuses on investments that support local workforce needs and build a talent pipeline through scholarships and fellowships for masters and Ph.D. students, faculty development and career and technical education (CTE) programs. Through collaborations with education partners and national initiatives, Intel is working to expand access to AI education and training across communities nationwide.

Advancing AI for American Youth, Intel’s AI-Ready Schools Initiative is rolling out nationwide, delivering 500 AI PCs to 250 K–12 schools with AI-optimized software, and comprehensive professional development to support safe, effective AI learning. The program includes more than 750 hours of open teaching content and professional development. Intel has committed to expanding educator training 10x to increase AI readiness across U.S. classrooms and help the next generation become responsible innovators, creators, and builders—not just consumers.

Intel is also supporting “Fostering the Future,” a ‘Be Best’ signature initiative by the First Lady, through a series of immersive AI bootcamps for foster care youth. Intel is providing $250K in grants to community colleges across key Intel sites to help equip foster youth with foundational AI skills and prepare them for future educational pathways and technology-focused careers.

As the Official Compute Partner of the McLaren Formula 1 and Arrow McLaren IndyCar teams, Intel will be present at key moments throughout the season, including the Freedom 250 IndyCar race in Washington, D.C., helping bring visibility to this milestone year.

Across these efforts, Intel’s focus remains consistent: advancing the technologies and talent that will shape the next chapter of American innovation in the AI era. As America looks ahead, Intel is working to help build a more resilient, secure, and competitive future, powered by trusted technology, domestic manufacturing and a workforce prepared for what comes next.

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Powered by Intel edge infrastructure, a local California network demonstrates how micro-servers can deliver high-speed connectivity at a low cost.

BELLFLOWER, Calif. — A young woman unwillingly must leave her disabled mother at home to walk to the local library just to use the public internet to pay the household bills. A few blocks away, a family rations its online time, relying entirely on a son’s cellular data plan to check critical medical updates because traditional broadband is too expensive. At the weekly outdoor farmers market, small business owners regularly turn away customers because weak cellular signals prevent them from accepting credit cards.

These are the everyday realities in Bellflower; a suburb of 75,000 people located just 25 minutes outside of Los Angeles. Despite its proximity to America’s second-largest city, the community has long suffered from persistent cellular blind spots and high telecom costs that have left vulnerable residents behind.

Now, a new municipal network called Bellflower Connect is aiming to bridge this digital divide. By using a private wireless network of solar-powered micro-servers with Intel® Xeon® processors inside, and AI-driven cybersecurity at the edge, the public-private partnership offers an affordable, low-power blueprint for community broadband that organizers plan to scale to 50 additional U.S. cities under 150,000 people over the next few years.

Cutting the Red Tape

To get the network off the ground, the city of Bellflower waived standard permit charges, allowed reception towers to be built on public buildings, and bypassed lengthy request-for-proposal processes. This allowed project partner Tradewinds Networks to enter into a long-term revenue-sharing contract with the city. The funding was split through a public-private agreement, using a $1 million municipal transportation grant alongside $2 million put up by Tradewinds.

The program also includes a workforce development element, training local students to become certified wireless broadband technicians. Having won the 2025 Mobile Breakthrough Award for Social Impact, Tradewinds Networks aligned the Bellflower Connect project to meet sustainable goals, taking into consideration city health, economic development, innovation, and sustainability.

“This model allows us to aggregate services and delivery while making the network self-sustaining,” said Keith Alexis, chief technology officer and founder of Tradewinds Networks. “We then share revenues back with the community, which enables us to keep up a sustainable ecosystem that drives loyalty and usership. Additionally, our AI-based GuardTower solution runs on Xeon to keep the system secure.”

In May 2026, Bellflower, California city officials along with Tradewinds Networks chief technology officer and founder Keith Alexis, center, held a ribbon cutting ceremony officially opening the Bellflower Connect smart city network. One of the newly constructed Intel-based micro-server towers is behind them. (Credit: Tradewinds Networks)

Bringing Power to the Edge

The secret to keeping user costs so low lies in how the data is handled. Traditional wireless networks rely on sending data back and forth to distant, massive cloud data centers packed with expensive, power-hungry graphics processors. That data journey requires heavy infrastructure and immense electricity, costs that big telecom companies pass on to consumers.

Bellflower Connect skips the cloud entirely. Instead, the network uses a fleet of 80 slim solar towers and repeaters placed around town. Each tower backhauls to central locations that feature compact Dell PowerEdge XR8000 series servers running a 4th Generation Intel Xeon processor. This allows data to be processed right there in the city, and in some cases, on the street corner, a concept known as edge computing.

Because Xeon processors are highly scalable and versatile, they “snap” into these lightweight towers easily, operating at a fraction of the cost, power, and space required by a standard cloud setup.

“By having off-the-shelf Intel Xeon system-on- chip processors directly in the towers, street corner or city facilities versus sending information through the cloud, the system is scalable, modular, and information is processed faster, at a lower cost, and using less power,”
–Vijay Kesavan, a principal engineer for Intel’s Network and Edge Group.

This local computing footprint also creates a digital foundation for future municipal upgrades. According to Kesavan, cities can easily snap new services right into the existing Xeon infrastructure, such as smart street lighting, air quality or traffic sensors, and water utility leak detection.

High Tech at Low Cost

While connection to the network is entirely optional, the financial impact on residents who have been using it has been immediate. Qualifying low-income households receive free internet access through a home modem that links wirelessly to the nearest neighborhood tower. Other residents can opt-in for $15 per month, while local businesses can access the network for $39 per month. Alexis notes that’s far below traditional commercial carriers.

As of May 2026, about 60 households are using the service during its early rollout phase. By the time construction finishes in mid-2027, organizers expect 10,000 households connected to the network. Free public Wi-Fi will also blanket local parks, libraries, and the city’s outdoor markets.

Local business owners are already preparing for the transition. Joe Ung, owner of Cassidy’s Corner Café, is opening a new location in Bellflower that will use the network for his operations and customer Wi-Fi.

“Having easy, affordable, accessible internet is a win-win for everyone,” Ung told KTLA-TV in an interview about the new network in May. “A lot of times people don’t see the everyday expenses of running a small business. Anywhere you can save, it’s a huge benefit.”

Scaling the Blueprint

The expansion beyond California is already underway. Wrightsville, Arkansas, is scheduled to begin Phase 1 of its network installation this summer, with eight additional U.S. cities currently navigating the design review and approval pipeline.

Though the yearlong rollout has faced logistical hurdles, project leaders say the community response validates the effort.

“We’ve had many difficulties assembling the model for this network, from rising costs to delayed fiber delivery,” Alexis said. “But residents have testified about the value they’ve gotten from it in city hall meetings. When installers meet residents who tell them how this is changing their lives, it makes it worth finding solutions to this complex problem.”

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Intel outlines progress across the AI compute ecosystem—highlighting open platforms, partners and real world momentum from silicon to software to systems.

SANTA CLARA, Calif., May 5, 2026 – At Computex 2026, Intel will share its vision for the next era of AI-driven computing and spotlight the ecosystem progress powering it.

Intel’s presence – anchored by a keynote from CEO Lip‑Bu Tan on June 2 – underscores momentum across compute, from AI PCs to the edge, data center, and cloud. It also shows how silicon innovation, open platforms, and strong ecosystem collaboration help customers deploy and scale AI with confidence.

As AI workloads scale across the compute continuum, Intel will reinforce the resurgence of the CPU as a critical engine for AI – complementing GPUs and accelerators to enable powerful, efficient, and scalable systems. Intel will also highlight progress in silicon innovation and the enduring role of x86 as a foundational architecture for AI across the world’s largest installed base and broadest ecosystem.

Building on this platform foundation, Intel leaders and ecosystem partners at Computex will demonstrate how Intel technologies align at the system level—helping customers deploy AI more efficiently from the client to the data center.

Computex 2026 attendees are invited to tune into the keynote online, engage with Intel leaders and ecosystem partners through invitation‑only sessions and demonstrations, and explore Intel technologies in action.

Computex 2026 Keynote Delivered by Intel CEO, Lip-Bu Tan

When: June 2 from 1:30 pm – 2:30 pm Taiwan Local Time

Where: Taipei Nangang Exhibition Center

Event Registration: Invitation-only event

Livestream: Watch the Intel keynote live on the Intel’s Computex Events Page and Intel’s YouTube Channel on Monday, June 2, starting at 1:30 p.m. Taiwan Local Time.

Keynote Replay: A video replay will be published on the Intel Newsroom after the livestream ends.

Robotics & Edge AI Pavillion (Powered by Intel)

When: Tuesday, June 2 – Friday, June 5:  9:30am – 5:30pm

Where: Taipei World Trade Center (TWTC)

Event Registration: Open to Computex-registered attendees.

More from Computex 2026: To see and experience more from Intel Computex 2026, visit the Intel Newsroom and follow along on social media with @IntelNews and @Intel on X, and Intel on LinkedIn.

• Artificial Intelligence
• Client Computing
• Software
• Computex

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Intel® Arc™ G-Series processors combine leadership performance and power efficiency to deliver smooth, immersive gameplay with exceptional battery life

What’s New: Intel today introduced Intel® Arc™ G-Series processors, a new family of products designed for next-generation handheld gaming systems. Launching with Intel Arc G3 and Intel Arc G3 Extreme processors running on Windows 11, the series builds on the architecture of Intel Core Ultra Series 3 (code-name Panther Lake) to bring optimized performance and power efficiency to portable play.

Designed for handheld with optimized core counts, power management, and software, Intel Arc G3 processors deliver leadership performance and efficiency for smooth, immersive gameplay and exceptional battery life without compromise. Handheld designs from leading partners will launch in the coming months, beginning with Acer’s Predator Atlas 8, MSI Claw 8 EX AI+, and OneXPlayer.

“Intel Arc G-Series represents years of focused innovation and a deep commitment to gaming. It delivers uncompromising PC performance in the palm of your hand, combined with the console-like accessibility and immediacy gamers expect. With cutting-edge graphics technologies like XeSS 3 and breakthrough efficiency for longer unplugged play, Intel Arc G-Series proves that while others make tradeoffs, gamers don’t have to.”
– Dan Rogers, Vice President and General Manager, PC Product, Client Computing Group

What it offers: Intel Arc G-Series processors are purpose-built for handheld gaming, developed in close collaboration with hardware partners and software developers to deliver broad compatibility and uncompromised handheld play.

Featuring up to Intel Arc B390 graphics built on Intel’s latest Xe3 architecture, Intel Arc G-Series processors enable advanced technologies like real-time ray tracing for high-fidelity visuals and XeSS 3 for higher performance, smoother gameplay, and improved responsiveness. Ongoing Day-0 driver support ensures new releases and existing libraries perform their best from day one.

Other notable specifications and features include:

• Immersive gaming with XBOX mode, a controller-optimized, console inspired, full-screen experience for Windows 11 PCs, which unifies your library of installed games.
• Faster game launches with Intel Precompiled Shaders, which downloads prebuilt shader files from the Intel cloud for select titles.
• Right-sized compute, with 2 P-Cores, 8 E-Cores, and 4 LP E-Cores manufactured on the Intel 18A process node technology, the most advanced logic node developed and manufactured in the United States.
• Advanced connectivity, including integrated Intel Wi-Fi 7 R2, dual Bluetooth 6, and Intel Thunderbolt™ 4 with support for Thunderbolt Share, giving users up to 40 Gbps bandwidth for high-speed storage, peripherals, and rapid transfer of large game libraries.

About XeSS 3: XeSS 3 enhances gaming with three key graphics technologies—XeSS Super Resolution, XeSS Multi-Frame Generation and Xe Low Latency.

• XeSS Super Resolution provides AI-based upscaling to deliver higher performance.
• XeSS Multi-Frame Generation adds multiple interpolated frames for a smoother gameplay experience.
• Xe Low Latency integrates with game engines to provide faster response to gamers’ inputs, unlocking more responsive gaming.

Availability: Intel and its OEM partners will share more details on Intel Arc G3 processors at Computex 2026. Handheld systems powered by Intel Arc G-Series processors will begin rolling out from OEM partners starting June 2026, with broader availability throughout the year. Refer to your preferred OEM vendor for specific system availability.

More Context: Intel Arc G-Series Processors Overview Deck | The Next Step in Handeld Gaming

The Small Print:

Performance varies by use, configuration and other factors. Learn more at www.intel.com/PerformanceIndex.

While Wi-Fi 7 is backward compatible with previous generations, new Wi-Fi 7 features require PCs configured with Intel Wi-Fi 7 solutions, PC OEM enabling, operating system support, and use with appropriate Wi-Fi 7 routers/APs/gateways. 6 GHz Wi-Fi 7 may not be available in all regions. More details at www.Intel.com/performance-wireless.

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Chip to Rackscale AI Solutions Delivered to Customers with the Help of Strategic Industry Partners

TAIPEI, Taiwan, June 2, 2026 – Today at Computex 2026, Intel unveiled new innovations that address customers’ chip- to-systems-level AI needs with solutions tailored to address their specific industry challenges, including:

• New rackscale AI infrastructure: Intel announced rackscale AI infrastructure for customers interested in scaling their inference and agentic workloads based on Intel® Xeon® processors and SambaNova SN-50 Reconfigurable Dataflow Units (RDUs).
• Agentic Cloud Offering for Disaggregated Inference: Vector Core Compute, a new purpose-built enterprise inference cloud formed by Vista Equity Partners and Cambium Capital, unveiled fully disaggregated inference running on Intel Xeon processors, SambaNova RDUs, and NVIDIA Blackwell GPUs.
• Deep industry solutions: Strategic collaborations with industry leaders, including Foxconn, Siemens, Hitachi, Echo Neurotechnologies, and Greenstone Biosciences focused on delivering integrated vertical customer solutions based on Intel processors and purpose-built silicon.
• Intel Xeon 6+ processors: Next-generation data center CPU built on Intel 18A and designed for high-density, scale-out workloads.
• PC, gaming handheld, and physical AI momentum: Broad partner support and customer uptake for the Series 3 family of processors.

“For more than five decades, Intel, its ecosystem partners, and Taiwan have brought the world the foundational technologies for the PC, Internet, and now AI eras,” said Lip-Bu Tan, CEO of Intel. “Today, with the rise of inference, agentic, and physical AI, Intel is poised to bring the world new innovations from the chip to systems level that promise to transform industry and society for the better. We are proud to join all our partners in building great products that will delight customers and bring the power of AI to more people as we create a brighter future together.”

Rackscale AI Infrastructure for Inference and Agentic Workloads

As the training of AI models has matured, and more AI applications have moved into production, the industry has witnessed an exponential rise in the demand for cost-effective and power-efficient AI inference. With the emergence of agentic AI, the growing demand for AI inference is changing the balance of power in the data center, returning the CPU to a position of prominence.

According to Creative Strategies CEO and principal analyst Ben Bajarin, while “the training-era world looked closer to a one-CPU-per-four-GPU relation in AI deployments, agentic inference changes that relationship to roughly a one-CPU-to-one-GPU (or less) ratio.”

Seeking to capitalize on this trend at a systems level, Intel, SambaNova, and Foxconn today announced their intent to build rackscale AI infrastructure for data center, hyperscale, and intelligence center deployments—built on Intel Xeon processors.

The companies are demonstrating production-ready racks that combine Intel Xeon processors with SambaNova SN-50 RDUs, which together are designed to deliver high performance AI inference with improved cost and power efficiency. As part of the collaboration, Foxconn will provide system integration capabilities for the new rackscale AI infrastructure. Foxconn also plans to manufacture a CPU-dense variant of the rackscale infrastructure for workloads that do not require additional acceleration, including cost-optimized inference, data processing, and hybrid AI.

Agentic Cloud Offering for Fully Disaggregated Inference

Vector Core Compute, a new purpose-built enterprise inference cloud formed by Vista Equity Partners and Cambium Capital, unveiled fully disaggregated inference. Running onstage at Computex, Intel, SambaNova, Vista Equity Partners and Cambium Capital showcased the first real-world demonstration of a disaggregated inference system, using Intel Xeon 6 processors for orchestration and execution, SambaNova SN40 RDUs for decode, and NVIDIA Blackwell GPUs for prefill—operating from a Vector Core Compute data center in Los Angeles, California.

Together.ai is the first commercial customer running workloads on Vector Core Compute’s agentic cloud, which delivered the fastest enterprise inference on the MiniMax 2.5 model of any architecture to date. Vista Equity Partners has secured early access to the company’s high-quality, low-cost inference solutions for its 90+ portfolio companies which serve more than 2.5 million enterprise customers and 750 million users worldwide.

Industry Specific Solutions Based on Intel Processors and Purpose-built Silicon

It is often stated that AI is transforming every industry. It is also true that the computing needs of specific industries vary widely due to differences in their business environments, processes, workflows, and customers.

Today, Intel announced several strategic partnerships designed to co-develop industry-specific vertical solutions based on Intel processors and purpose-built silicon, including:

• Foxconn: The world’s largest electronics manufacturer is working with Intel to provide systems integration capabilities for rackscale AI infrastructure and explore collaboration in design services and custom silicon development.
• Siemens: The leading technology company focused on industry, infrastructure, transport, and healthcare and Intel have expanded their existing collaboration. In 2023, Siemens and Intel first joined forces; now the two companies are strengthening their collaboration across the entire value chain from design to manufacturing to chips embedded in Siemens products. Siemens brings its capabilities for the design, manufacturing, and lifecycle management of chips, as well as fab digitalization, automation, and electrification. This collaboration will enable the exploration of use cases for purpose-built Intel silicon for Siemens’ varied compute requirements, which may include edge devices, high-performance computing (HPC), and robotics.
• Hitachi: A global leader in digital innovation and sustainable solutions and Intel intend to work together on a range of solutions including foundry tools and quantum computing.
• Echo Neurotechnologies: The developer of neuroscience and brain-computer interface solutions and Intel are exploring new neuromorphic technologies to advance neuro-AI, speech neuroscience, brain-computer interfaces, and Intel’s future neuromorphic and conventional hardware architectures.
• Greenstone Biosciences: The Silicon Valley biotech company plans to use Intel processors, purpose-built silicon, and the Intel Health and Life Sciences AI Suite to accelerate human-centric drug development using stem cells, organoids, genomics, and AI.

Intel Xeon 6+ Processors for Next Generation Data Centers

Extending this week’s announcements from data centers and racks down to chip-level innovations, Intel announced the availability of Intel Xeon 6+ processors, which provide greater performance density, power efficiency, and operational scale for cloud-native, agentic AI, and network-intensive workloads.

Built on Intel 18A—its first use in a data center CPU—Xeon 6+ is engineered for sustained performance under real-world power constraints—addressing the orchestration, concurrency, and data movement demands of emerging agentic AI.

Xeon 6+ can be configured for AI rackscale infrastructure purpose-built for hosting agents at maximum density. For example, a single liquid-cooled rack can deliver 36,864 cores using 32U of compute space, which provides the highest agent density available (at approximately 100-kilowatt rack power compute).

Optimized for environments where watts per rack, throughput per core, and latency predictability are critical, Xeon 6+ emphasizes scale-out performance—making room for new AI workloads without requiring disruptive data center redesign.

Series 3 Scale and Momentum

Core Ultra Series 3, built on Intel 18A, continues to experience strong customer uptake for a platform that now powers more than 325 consumer and commercial PC designs. Leveraging the same advanced IP as Ultra, the recently launched Core processors are enabling a new class of thin, sleek, powerful, and efficient PCs at affordable price points. Series 3 also pushes into the growing market of handheld gaming with the new Intel Arc G-series processors, which will be available starting this month. The expansion of the Series 3 processor family is being accelerated by increased 18A yields and strong customer and partner engagement.

Beyond the PC, Intel has powered edge devices in manufacturing, robotics, retail, and smart cities for decades. For the first time, the latest Series 3 IP scaling in the PC ecosystem will deploy in parallel to thousands of edge customers globally. Over 130 customers have already chosen Series 3 to power edge AI and robotics designs.

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